Heat transfer in miniaturized electronic equipment. by Cornell Aeronautical Laboratory.

Cover of: Heat transfer in miniaturized electronic equipment. | Cornell Aeronautical Laboratory.

Published by Bureau of Ships, Navy Dept. in Washington .

Written in English

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  • Miniature electronic equipment.,
  • Heat -- Transmission.

Book details

LC ClassificationsTK7870 .C62 1955
The Physical Object
Paginationiii, 85 p.
Number of Pages85
ID Numbers
Open LibraryOL6193729M
LC Control Number55063303

Download Heat transfer in miniaturized electronic equipment.

Book: All Authors / Contributors: Cornell Aeronautical Laboratory. OCLC Number: Notes: "Navships ," "Originally published as Report number HFD, dated 3 March [under title: Survey report of the state of the art of heat transfer in miniaturized electronic equipment]." Description: iii, 85 pages illustrations 28 cm.

Heat Transfer: Thermal Management of Electronics details how engineers can use intelligent thermal design to prevent heat-related failures, increase the life expectancy of the system, and reduce emitted noise, energy consumption, cost, and time to market.

Appropriate thermal management can also create a significant market differentiation /5(5). out of 5 stars If it contained a section on calculating heat loss in electronic equipment it would be the perfect textbook.

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* Covers all aspects of heat transfer, including micro-scale and heat transfer in electronic equipment. * An associated Web site offers computer formulations on thermophysical properties that provide the most up-to-date values.

presented at the AIAA/ASME 4th Thermophysics and Heat Transfer Conference, Boston, Massachusetts, June; sponsored by the K Committee on Heat Transfer in Electronic Equipment, the Heat Transfer Division, ASME ; edited by A. Bar-Cohen. This shorter text fully explains the fundamentals of heat transfer, including heat conduction, convection, radiation and heat exchangers.

The fundamentals are then applied to a variety of engineering examples, including topics of special and current interest like solar collectors, cooling of electronic equipment, and energy conservation in. Heat Transfer Handbook, Volume 1. Adrian Bejan, Allan D. Kraus. John Wiley & Sons, Technology & Engineering- pages.

3Reviews. Chapters contributed by thirty world-renown experts.5/5(3). Review of Heat Transfer Technologies in Electronic Equipment Article (PDF Available) in Journal of Electronic Packaging (4) December with 1, Reads How we measure 'reads'.

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analysis ASME baffle boiling bubble calculated Chem component condenser constant convection cooling correlations cost crossflow curve cycle diameter dimensionless effect energy enhanced enthalpy equation equipment evaluated feedwater heater Figure film finned tubes flow pattern flow rate fluid friction factor geometry given heat duty heat 5/5(1).

Heat Transfer. September ; (9): – Review of Heat Transfer Technologies in Electronic Equipment,” ASME J. Electron. Packag. Electro-adsorption Chiller: A Miniaturized Cooling Cycle with Applications from Microelectronics to Conventional Air-conditioning. Four specific illustrations of industrial applications of heat transfer to electronic components and equipment are presented.

The first describes use of heat transfer and fluid mechanics to predict accurately the thermal performance of a newly developed vacuum tube which dissipates 25 kw. The second presents the analysis and some samples of the cold-plate technique used to cool highly compact miniaturized electronic equipment.

Heat Transfer in Miniaturized Electronic Equipment: NAVSHIPS* by Cornell Aeronautical Lab download: Guide Manual of Cooling Methods for Electronic Equipment: NAVSHIPS* by Cornell Aeronautical Lab download 18 MB pdf: Design Manual of Natural Methods for Cooling Electronic Equipment: NAVSHIPS* by Cornell.

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Heat Transfer: Thermal Management of Electronics details how engineers can use intelligent thermal design to prevent heat-related failures, increase the life expectancy of the system, and reduce emitted noise, energy consumption, cost, and time to market.

Appropriate thermal management can also create a significant market differentiation. Conduction Heat Transfer Robert F. Boehm Introduction Conduction heat transfer phenomena are found throughout virtually all of the physical world and the industrial domain.

The analytical description of this heat transfer mode is one of the best understood. Some of the bases of understanding of conduction date back to early history. ever us list a few of the process heat transfer problems that must be solved before we can drink a glass of iced tea. •A variety of high-intensity heat transfer processes are involved with combustion and chemical reaction in the gasifier unit itself.

•The gas goes through various cleanup and pipe-delivery processes. Heat transfer in miniaturized electronic equipment. By Cornell Aeronautical Laboratory. Abstract "Originally published as Report number HFD, dated 3 March [under title: Survey report of the state of the art of heat transfer in miniaturized electronic equipment]""Navships ,"Bibliography: p.

Mode of access: Internet. Book October the increased surface to volume ratio as well as of the improved heat and mass transfer behavior of miniaturized equipment.

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The technical routes to build up the new miniaturized system were illustrated. Being flowing based, completely electricity-controllable, and almost entirely made of metal, the new cooling device has a rather strong heat dissipation capability compared with that of the conventional forced liquid or.

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One of the most prominent industrial applications of heat transfer science and engineering has been electronics thermal Rack / equipment room heat load forecast [12] Telecommunications equipment rooms, whether central but miniaturized liquid cooling loops and in some cases MEMS-based coolers such as EDIFICE require.

With the advance of micro-electro-mechanical systems, on-board electronic/electrical devices become more integrated and miniaturized. It means that these highly-advanced devices should rely on a high heat-flux dissipation method to maintain an effective and safe operation. Basics of Heat Transfer: Teacher Slides- Basics of Heat Transfer: PPT Slides: kb: Basics of Heat Transfer: Worked Examples-Basics of Heat Transfer: PDF: kb: Basics of Heat Transfer: Question Bank-Basics of Heat Transfer: PDF: kb: One Dimensional Steady State Heat Conduction: Teacher Slides- One Dimensional Steady State Heat.

• Heat transfer processes and analysis • New data and methods • Applications-oriented, step-by-step examples • Heat balance and radiant time series methods Second Edition Load Calculation Applications Manual Cover IP 2nd 1 11/6/ PM. Heat transfer enhancement in single-phase and two-phase flow heat exchangers in important in such industrial applications as power generating plant, process and chemical industry, heating, ventilation, air conditioning and refrigeration systems, and the cooling of electronic equipment.

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Cornell Aeronautical Laboratory: A guide manual of cooling methods for electronic equipment. (Buffalo, N. ;, []), also by United States Navy Department Bureau of Ships (page images at HathiTrust; US access only) Cornell Aeronautical Laboratory: Heat transfer in miniaturized electronic equipment.

Purdue University ME G Heat Transfer in Electronic Systems. References - Spring (This list of books is provided as a useful resource, and is not intended to signify that reference to all these books is required for this course. A more cost-effective, efficient solution for maximizing heat transfer and enabling higher heat density equipment frames can be accomplished by utilizing properly positioned phasemore» Pumping low pressure, oil-free phase changing refrigerant through microchannel heat exchangers can provide up to 90% less energy consumption for the primary.

Ordinarily, miniaturized electronic equipment is also quite small. Furthermore, air-which is inexpensive and often designer of electronic equipment cooling systems is often faced with the problem of cooling miniaturized, high heat- dissipating components to a rather low temperature with a fluid having definite heat transfer limitations.

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"Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel." Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

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